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{Parameters for the new MOS models developed by Michael Godfrey}
{This is an example parameter file, annotated to show how to }
{determine parameter values from MOSIS data or SPICE extractions }
{This example is for an N-well process -- to model a P-well }
{process, reverse N and P in well-related discussions. }
{The syntax is: }
{1. Lines enclosed in braces like this one are comments. }
{2. 32: <name> <var_name> <value> indicates a data field }
{ where: <name> is the object ("gate") name, }
{ <var_name> is the variable in the object, }
{ <value> is the value assigned to the variable. }
{Physical Constants}
{Temperature}
32: Physical T 298
{Boltzmann's constant}
32: Physical k 1.380658e-23
{Charge on an electron}
32: Physical q 1.60217733e-19
{permittivity of vacuum f/m}
32: Physical e_v 8.854187817e-12
{permittivity of Si f/m}
32: Physical e_s 1.035939974589e-010
{permittivity of SiO2 f/m}
32: Physical e_ox 3.453133248630e-011
{silicon-oxide interface charge}
32: Physical phi_ms -0.3
{The parameters below are determined from process and }
{specific run data. Most of this information may be taken from }
{an appropriate MOSIS PRM file. Below are the relevant sections }
{taken from the MOSIS file n6ay.prm }
{The values used by analog are indicated by [name]. For most values }
{there is an N-device and a P-device value. }
{Each anaLOG variable is shown in [...], and is marked by ^^^^ }
{under the name. }
{TRANSISTOR PARAMETERS W/L N-CHANNEL P-CHANNEL UNITS }
{ Delta length 0.13[DeltaL] 0.16[DeltaL] microns }
{ ^^^^^^^^ ^^^^^^^^ }
{ (L_eff = L_drawn-DL) }
{ Delta width 0.33[DeltaW] 0.34[DeltaW] microns }
{ ^^^^^^^^ ^^^^^^^^ }
{ (W_eff = W_drawn-DW) }
{CAPACITANCE PARAMETERS N+DIFF P+DIFF POLY METAL1 METAL2 METAL3 UNITS}
{ Area (substrate) 544 932 90 37 19 16 aF/um^2}
{ [aCactive] [aCactive] }
{ ^^^^^^^^^^ ^^^^^^^^^^ }
{ Area (poly) 60 18 aF/um^2}
{ Area (metal1) 43 16 aF/um^2}
{ Area (metal2) 45 aF/um^2}
{ Area (N+active) 3619 aF/um^2}
{ Area (P+active) 3431 aF/um^2}
{ Area (cap well) 2131 aF/um^2}
{ Fringe (substrate) 223 242 aF/um}
{ Fringe (N+active) 107 aF/um}
{ N6AY SPICE LEVEL3 PARAMETERS}
{.MODEL CMOSN NMOS LEVEL=3 PHI=0.700000[psi] TOX=9.5000E-09[Tox] XJ=0.200000U TPG=1}
{ ^^^^^ ^^^^^ }
{+ VTO=0.6674 DELTA=1.4270E+00 LD=6.3300E-08 KP=1.7146E-04 }
{+ UO=471.7[mu0] THETA=1.6690E-01 RSH=3.3470E+01 GAMMA=0.5219 }
{ ^^^^^ }
{+ NSUB=1.0840E+17[Na] NFS=5.9080E+11 VMAX=2.2650E+05 ETA=2.0550E-02 }
{ ^^^^ }
{+ KAPPA=2.1270E-01 CGDO=9.0000E-11 CGSO=9.0000E-11[linCgs] }
{ ^^^^^^^^ }
{+ CGBO=3.6007E-10 CJ=5.69E-04[aCactive] MJ=0.661 CJSW=2.00E-11 }
{ ^^^^^^^^^^ }
{+ MJSW=0.609 PB=0.99 }
{* Weff = Wdrawn - Delta_W }
{* The suggested Delta_W is 3.3260E-07 }
{.MODEL CMOSP PMOS LEVEL=3 PHI=0.700000[psi] TOX=9.5000E-09[Tox] XJ=0.200000U TPG=-1}
{ ^^^^^ ^^^^^
{+ VTO=-0.9188 DELTA=3.5350E-01 LD=7.8860E-08 KP=3.8312E-05 }
{+ UO=105.4[mu0] THETA=3.3670E-02 RSH=1.6950E+01 GAMMA=0.7396 }
{ ^^^^^ }
{+ NSUB=2.1770E+17[Na] NFS=5.9080E+11 VMAX=1.5650E+05 ETA=1.7260E-02 }
{ ^^^^ }
{+ KAPPA=8.8780E+00 CGDO=9.0000E-11 CGSO=9.0000E-11[linCgs] }
{ ^^^^^^^^ }
{+ CGBO=3.6237E-10 CJ=9.19E-04[aCactive] MJ=0.321 CJSW=4.60E-10 }
{ ^^^^^^^^^^ }
{+ MJSW=0.100 PB=0.42 }
{* Weff = Wdrawn - Delta_W }
{* The suggested Delta_W is 3.3680E-07 }
{parameters for N model}
{MOSIS Process Name: See MOSIS file cmos14tb-tech.inf}
32: DevTechN Process SCN3M_SUBM
{photolithography scaling factor -- identical for P and N}
{Value for 0.5um process: appropriate for HP CMOS14TB}
32: DevTechN lambda 0.25e-6
{oxide thickness}
{This parameter may be taken from the HP specs (sadly HP has }
{declared the specs to be proprietary (like, Intel would care??) }
{so it is necessary to sign a non-disclosure with MOSIS to learn }
{the process value. However, the value may also be taken from the }
{SPICE LEVEL 3 data in a PRM file for the HP cmos14tb process. }
32: DevTechN Tox 90e-10
{potential at neutral edge of depletion region}
32: DevTechN psi 0.7
{bulk doping concentration}
32: DevTechN Na 1.0840e17
{carrier mobility}
32: DevTechN mu0 471.7
{Ldrawn-Leff}
32: DevTechN deltaL 0.13e-6
{Wdrawn-Weff}
32: DevTechN deltaW 0.33e-6
{drain-dependence Na factor}
32: DevTechN del_NaS 0
{Early effect slope parameter}
32: DevTechN Early_s 0.16
{Early effect intercept parameter}
32: DevTechN L_0 0.1e-6
{Run Specific Parameters}
{The specific fab run name}
32: RunSpecN Fabrun N6AY
{fixed oxide charge}
32: RunSpecN Qss 0.0
{Na multiplicative delta}
32: RunSpecN del_Na0 1
{mu multiplicative delta}
32: RunSpecN del_mu 1
{AC Parameters}
{Capacitance modeling is the weak link in the current version }
{of these models. All capacitances are modeled linearly. See }
{comments below for details on each value }
{N+ active (source/drain area) Capacitance F/um^2 }
{MOSIS CAPCITANCE TABLE Area (substrate) -- N+DIFF or SPICE CMOSN CJ }
32: DevTechN aCactive 544e-18
{Well-to-bulk Capacitance F/um^2 }
{Since the n-channel transistor is in the substrate, this parameter }
{is meaningless. We choose an insignificantly small value (not zero) to }
{prevent numerical problems in the simulation engine }
32: DevTechN aCwell 1e-18
{Overlap capacitance between gate and source F/um }
{SPICE CGDO or CGSO * 10-6}
32: DevTechN linCgs 90e-18
{Gate capacitance -- used for AC parasitics only F/um^2}
{The nonlinear C(V) function is upper-bounded by Cox, }
{and close to CGBO in subthreshold, which we use below. }
{Replace with COX for conservative delay estimates for digital designs. }
32: DevTechN aCgw 3.6007e-16
{Parameters for P model}
{oxide thickness}
32: DevTechP Tox 90e-10
{potential at neutral edge of depletion region}
32: DevTechP psi 0.7
{bulk doping concentration}
32: DevTechP Na 2.177e17
{carrier mobility}
32: DevTechP mu0 105.4
{Ldrawn-Leff}
32: DevTechP deltaL 0.16e-6
{Wdrawn-Weff}
32: DevTechP deltaW 0.34e-6
{drain-dependence Na factor}
32: DevTechP del_NaS 0
{Early effect slope parameter}
32: DevTechP Early_s 0.16
{Early effect intercept parameter}
32: DevTechP L_0 0.1e-6
{Run Specific Parameters}
{fixed oxide charge}
32: RunSpecP Qss 0.00010
{oxide thickness}
32: RunSpecP del_Na0 1
{oxide thickness}
32: RunSpecP del_mu 1
{AC Parameters}
{Capacitance modeling is the weak link in the current version }
{of these models. All capacitances are modeled linearly. See }
{comments below for details on each value }
{P+ active (source/drain area) Capacitance F/um^2}
{MOSIS CAPCITANCE TABLE Area (substrate) -- P+DIFF or SPICE CMOSP CJ }
32: DevTechP aCactive 932e-18
{Well-to-bulk Capacitance F/um^2}
{Since the p-channel transistor is in the well, this parameter has }
{meaning. This parameter is not specified by MOSIS, nor is it in the HP }
{specs, so we have to make a guess. }
{Here, we use half the N+DIFF capacitance as a (very loose) upper bound }
32: DevTechP aCwell 272e-18
{Overlap capacitance between gate and source F/um }
{SPICE CGDO or CGSO * 10-6}
32: DevTechP linCgs 90e-18
{Gate capacitance -- used for AC parasitics only F/um^2}
{The nonlinear C(V) function is upper-bounded by Cox, }
{and close to CGBO in subthreshold, which we use below. }
{Replace with COX for conservative delay estimates for digital designs. }
32: DevTechP aCgw 3.6237e-16
{Individual Transistor Models}
{Gate width of transistor, lambda}
32: Nfet7F Wdrawn 6
{Gate length of transistor, lambda}
32: Nfet7F Ldrawn 4
{Area of source region, m^2}
32: Nfet7F SArea 36e-6
{Area of drain region, m^2}
32: Nfet7F DArea 36e-6
{Area of well region, m^2}
32: Nfet7F WArea 100e-6
{offset in Na density, multiplicative unitless}
32: Nfet7F NaOffset 1.0
{offset in mobility, multiplicative unitless}
32: Nfet7F MuOffset 1.0
{offset in Qss, additive (C)}
32: Nfet7F QssOffset 0.0
{Gate width of transistor, lambda}
32: Nfet7T Wdrawn 6
{Gate length of transistor, lambda}
32: Nfet7T Ldrawn 4
{Area of source region, m^2}
32: Nfet7T SArea 36e-6
{Area of drain region, m^2}
32: Nfet7T DArea 36e-6
{Area of well region, m^2}
32: Nfet7T WArea 100e-6
{offset in Na density, multiplicative unitless}
32: Nfet7T NaOffset 1.0
{offset in Mu0 mobility, multiplicative unitless}
32: Nfet7T MuOffset 1.0
{offset in Qss, additive (C)}
32: Nfet7T QssOffset 0.0
{Gate width of transistor, lambda}
32: Pfet7F Wdrawn 6
{Gate length of transistor, lambda}
32: Pfet7F Ldrawn 4
{Area of source region, m^2}
32: Pfet7F SArea 36e-6
{Area of drain region, m^2}
32: Pfet7F DArea 36e-6
{Area of well region, m^2}
32: Pfet7F WArea 100e-6
{offset in Na density, multiplicative unitless}
32: Pfet7F NaOffset 1.0
{offset in mobility, multiplicative unitless}
32: Pfet7F MuOffset 1.0
{offset in Qss, additive (C)}
32: Pfet7F QssOffset 0.0
{Gate width of transistor, lambda}
32: Pfet7T Wdrawn 6
{Gate length of transistor, lambda}
32: Pfet7T Ldrawn 4
{Area of source region, m^2}
32: Pfet7T SArea 36e-6
{Area of drain region, m^2}
32: Pfet7T DArea 36e-6
{Area of well region, m^2}
32: Pfet7T WArea 100e-6
{offset in Na density, multiplicative unitless}
32: Pfet7T NaOffset 1.0
{offset in mobility, multiplicative unitless}
32: Pfet7T MuOffset 1.0
{offset in Qss, additive (C)}
32: Pfet7T QssOffset 0.0
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