File: combined_glossary.html

package info (click to toggle)
pcb-rnd 3.1.7b-2
  • links: PTS, VCS
  • area: main
  • in suites: forky, sid
  • size: 33,108 kB
  • sloc: ansic: 213,400; yacc: 6,241; sh: 4,698; awk: 3,016; makefile: 2,254; lex: 1,166; python: 519; xml: 261; lisp: 154; tcl: 67; perl: 34; javascript: 6; ruby: 5
file content (281 lines) | stat: -rw-r--r-- 10,863 bytes parent folder | download | duplicates (4) 
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
 
<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.01 Transitional//EN" "http://www.w3.org/TR/html4/loose.dtd">
<html>
<head>
	<title> pcb-rnd user manual </title>
	<meta http-equiv="Content-Type" content="text/html;charset=us-ascii">
	<link rel="stylesheet" type="text/css" href="../default.css">
</head>
<body>
<h1> pcb-rnd User Manual: Appendix </h1>

<h2>9.6 Glossary</h2>

<h3>Useful terminology for a common vernacular</h3>
This glossary is under construction.  It currently combines terms that focus 
pertain to any of the following facet subjects. 
<ol>
<li>pcb-rnd specific terminology</li>
<li>pcb manufacturer terminology</li>
<li>pcb CAD layout and design terminology</li>
<li>CAD/graphics common design terminology</li>
</ol>
We will fill in definitions, continue to add terms, and determine an
appropriatly faceted method to index the terms.
<p>
<table border=1>
<caption><b>Combined Glossary Table</b>
<th>term<th>description<th>facets
<tr><td> 5/5 <td>5mil minimum traces & 5mil minimum spacing</td></tr>
<tr><td> 6/5 <td>6mil minimum traces & 5mil minimum spacing</td></tr>
<tr><td> AMC <td>aluminum metal core</td></tr>
<tr><td><dt>ACY</dt></tr></td>
<tr><td><dt>additive</dt></tr></td>
<tr><td><dt>Adhesive</dt></tr></td>
<tr><td><dt>Altium</dt></tr></td>
<tr><td><dt>Annular Ring</dt></tr></td>
<tr><td><dt>Annulus</dt></tr></td>
<tr><td><dt>AOI automatic optical inspection</dt></tr></td>
<tr><td><dt>Aperture</dt></tr></td>
<tr><td><dt>Arc</dt></tr></td>
<tr><td><dt>Array</dt></tr></td>
<tr><td><dt>assembly</dt></tr></td>
<tr><td><dt>AutoCAD</dt></tr></td>
<tr><td><dt>autorouter</dt></tr></td>
<tr><td><dt>Autotrax</dt></tr></td>
<tr><td><dt>Autotrax</dt></tr></td>
<tr><td><dt>AXI automated x-ray inspection</dt></tr></td>
<tr><td><dt>Axial</dt></tr></td>
<tr><td><dt>Bakelite</dt></tr></td>
<tr><td><dt>BGA</dt></tr></td>
<tr><td><dt>Blind Via </dt></tr></td>
<tr><td><dt>bloat</dt></tr></td>
<tr><td><dt>board house</dt></tr></td>
<tr><td><dt>Board Thickness</dt></tr></td>
<tr><td><dt>Breadboard</dt></tr></td>
<tr><td><dt>buffer</dt></tr></td>
<tr><td><dt>Buried Via </dt></tr></td>
<tr><td><dt>bus</dt></tr></td>
<tr><td><dt>C4 Controlled collapse chip connection</dt></tr></td>
<tr><td><dt>CAD</dt></tr></td>
<tr><td><dt>CAM files</dt></tr></td>
<tr><td><dt>CAM</dt></tr></td>
<tr><td><dt>Capture</dt></tr></td>
<tr><td><dt>Card Edge connector</dt></tr></td>
<tr><td><dt>Castellations</dt></tr></td>
<tr><td><dt>CEM-1</dt></tr></td>
<tr><td><dt>CEM-3</dt></tr></td>
<tr><td><dt>Centroid</dt></tr></td>
<tr><td><dt>centroid</dt></tr></td>
<tr><td><dt>Chip Scale Package</dt></tr></td>
<tr><td><dt>clad</dt></tr></td>
<tr><td><dt>Clearance</dt></tr></td>
<tr><td><dt>Coating (Spin, Roll, Film)</dt></tr></td>
<tr><td><dt>COB</dt></tr></td>
<tr><td><dt>Component Side	</dt></tr></td>
<tr><td><dt>Component</dt></tr></td>
<tr><td><dt>Computer Aided Design</dt></tr></td>
<tr><td><dt>Computer Aided Machining</dt></tr></td>
<tr><td><dt>Conformal Coating</dt></tr></td>
<tr><td><dt>Conformal coating</dt></tr></td>
<tr><td><dt>connect</dt></tr></td>
<tr><td><dt>Copper Foil</dt></tr></td>
<tr><td><dt>Copper weight</dt></tr></td>
<tr><td><dt>Copper</dt></tr></td>
<tr><td><dt>copper</dt></tr></td>
<tr><td><dt>courtyard</dt></tr></td>
<tr><td><dt>cte coefficient of thermal expansion (see tce)</dt></tr></td>
<tr><td><dt>Curve, open</dt></tr></td>
<tr><td><dt>delamination</dt></tr></td>
<tr><td><dt>DFSM Dry film soldermask</dt></tr></td>
<tr><td><dt>Dialectric</dt></tr></td>
<tr><td><dt>Diameter</dt></tr></td>
<tr><td><dt>Dielectric</dt></tr></td>
<tr><td><dt>differential pair</dt></tr></td>
<tr><td><dt>DIP</dt></tr></td>
<tr><td><dt>Discrete Component</dt></tr></td>
<tr><td><dt>double-sided</dt></tr></td>
<tr><td><dt>DRC design rule check</dt></tr></td>
<tr><td><dt>Drill file</dt></tr></td>
<tr><td><dt>Eagle</dt></tr></td>
<tr><td><dt>EDF</dt></tr></td>
<tr><td><dt>EDI Electronic Data Interchange</dt></tr></td>
<tr><td><dt>Endpoint</dt></tr></td>
<tr><td><dt>ENIG Electroless Nickel Immersion Gold</dt></tr></td>
<tr><td><dt>epoxy resin</dt></tr></td>
<tr><td><dt>ESD Electrostatic Discharge</dt></tr></td>
<tr><td><dt>Etching</dt></tr></td>
<tr><td><dt>Excellon</dt></tr></td>
<tr><td><dt>explicit layer</dt></tr></td>
<tr><td><dt>fabrication fab</dt></tr></td>
<tr><td><dt>Feedthrough Via</dt></tr></td>
<tr><td><dt>fidocad</dt></tr></td>
<tr><td><dt>Fiducial</dt></tr></td>
<tr><td><dt>Finger</dt></tr></td>
<tr><td><dt>Finite Element Filter</dt></tr></td>
<tr><td><dt>Fixture</dt></tr></td>
<tr><td><dt>flags</dt></tr></td>
<tr><td><dt>Flex</dt></tr></td>
<tr><td><dt>Flip chip</dt></tr></td>
<tr><td><dt>flood fill</dt></tr></td>
<tr><td><dt>Flux</dt></tr></td>
<tr><td><dt>Flying probe</dt></tr></td>
<tr><td><dt>Foil</dt></tr></td>
<tr><td><dt>font</dt></tr></td>
<tr><td><dt>Footprint</dt></tr></td>
<tr><td><dt>FR-1</dt></tr></td>
<tr><td><dt>FR-2</dt></tr></td>
<tr><td><dt>FR-3</dt></tr></td>
<tr><td><dt>FR-4</dt></tr></td>
<tr><td><dt>Gcode</dt></tr></td>
<tr><td><dt>gEDA</dt></tr></td>
<tr><td><dt>Gerber</dt></tr></td>
<tr><td><dt>grid snap</dt></tr></td>
<tr><td><dt>grid-pitch</dt></tr></td>
<tr><td><dt>grid</dt></tr></td>
<tr><td><dt>Hard Gold pcb surface finish (slip rings, fingers, etc)</dt></tr></td>
<tr><td><dt>HASL Hot Air surface levelling</dt></tr></td>
<tr><td><dt>High Density Interconnect(HDI)</dt></tr></td>
<tr><td><dt>Hole</dt></tr></td>
<tr><td><dt>Immersion Silver</dt></tr></td>
<tr><td><dt>Immersion Tin</dt></tr></td>
<tr><td><dt>implicit layer</dt></tr></td>
<tr><td><dt>Integrated Circuit</dt></tr></td>
<tr><td><dt>IPC (circa 1957)</dt></tr></td>
<tr><td><dt>JIT</dt></tr></td>
<tr><td><dt>Kapton</dt></tr></td>
<tr><td><dt>KiCAD</dt></tr></td>
<tr><td><dt>Knife</dt></tr></td>
<tr><td><dt>Laminate</dt></tr></td>
<tr><td><dt>Land</dt></tr></td>
<tr><td><dt>Laser </dt></tr></td>
<tr><td><dt>Layer Group</dt></tr></td>
<tr><td><dt>Layer Sequence</dt></tr></td>
<tr><td><dt>Layers (Physical)</dt></tr></td>
<tr><td><dt>Layers (Virtual)</dt> </tr></td>
<tr><td><dt>Library</dt></tr></td>
<tr><td><dt>Lihata</dt></tr></td>
<tr><td><dt>mask</dt></tr></td>
<tr><td><dt>Masonite</dt></tr></td>
<tr><td><dt>Mentor</dt></tr></td>
<tr><td><dt>Mil</dt></tr></td>
<tr><td><dt>Milling</dt></tr></td>
<tr><td><dt>milling</dt></tr></td>
<tr><td><dt>Mirroring</dt></tr></td>
<tr><td><dt>Mouse bites</dt></tr></td>
<tr><td><dt>Multilayer</dt></tr></td>
<tr><td><dt>neckdown</dt></tr></td>
<tr><td><dt>negative process</dt></tr></td>
<tr><td><dt>Negative transfer</dt></tr></td>
<tr><td><dt>NEMA</dt></tr></td>
<tr><td><dt>Net</dt></tr></td>
<tr><td><dt>Netlist</dt></tr></td>
<tr><td><dt>ODB++</dt></tr></td>
<tr><td><dt>OrCAD</dt></tr></td>
<tr><td><dt>OSP Organic Solderability preservative</dt></tr></td>
<tr><td><dt>outline</dt></tr></td>
<tr><td><dt>Package</dt></tr></td>
<tr><td><dt>Pad</dt></tr></td>
<tr><td><dt>padstack</dt></tr></td>
<tr><td><dt>Panel Service</dt></tr></td>
<tr><td><dt>panel</dt></tr></td>
<tr><td><dt>Panelization</dt></tr></td>
<tr><td><dt>paste stencil</dt></tr></td>
<tr><td><dt>paste</dt></tr></td>
<tr><td><dt>Path</dt></tr></td>
<tr><td><dt>pcb-rnd</dt></tr></td>
<tr><td><dt>PCB</dt></tr></td>
<tr><td><dt>PDIP</dt></tr></td>
<tr><td><dt>phenolic resin</dt></tr></td>
<tr><td><dt>Photoengraving</dt></tr></td>
<tr><td><dt>Photoresist</dt></tr></td>
<tr><td><dt>pick and place pnp</dt></tr></td>
<tr><td><dt>Pin</dt></tr></td>
<tr><td><dt>pinout</dt></tr></td>
<tr><td><dt>pitch</dt></tr></td>
<tr><td><dt>PLCC plastic lead chip carrier</dt></tr></td>
<tr><td><dt>plotter</dt></tr></td>
<tr><td><dt>Polygon hole</dt></tr></td>
<tr><td><dt>Polygon, complex</dt></tr></td>
<tr><td><dt>Polygon, concave</dt></tr></td>
<tr><td><dt>Polygon, convex</dt></tr></td>
<tr><td><dt>Polygon, irregular</dt></tr></td>
<tr><td><dt>Polygon, regular</dt></tr></td>
<tr><td><dt>Polygon, simple</dt></tr></td>
<tr><td><dt>Polygon</dt></tr></td>
<tr><td><dt>polygon</dt></tr></td>
<tr><td><dt>positive process</dt></tr></td>
<tr><td><dt>Positive transfer</dt></tr></td>
<tr><td><dt>Protel</dt></tr></td>
<tr><td><dt>PTH</dt></tr></td>
<tr><td><dt>Pyralux AP</dt></tr></td>
<tr><td><dt>Pyralux FR</dt></tr></td>
<tr><td><dt>Pyralux LF</dt></tr></td>
<tr><td><dt>QFP</dt></tr></td>
<tr><td><dt>Radial Lead</dt></tr></td>
<tr><td><dt>Raster</dt></tr></td>
<tr><td><dt>rat</dt></tr></td>
<tr><td><dt>Ratsnest</dt></tr></td>
<tr><td><dt>refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator</dt></tr></td>
<tr><td><dt>reflow</dt></tr></td>
<tr><td><dt>Registration</dt></tr></td>
<tr><td><dt>resin</dt></tr></td>
<tr><td><dt>resist</dt></tr></td>
<tr><td><dt>RF</dt></tr></td>
<tr><td><dt>Rigid-Flex</dt></tr></td>
<tr><td><dt>Route and Retain</dt></tr></td>
<tr><td><dt>routing style</dt></tr></td>
<tr><td><dt>Routing</dt></tr></td>
<tr><td><dt>routing</dt></tr></td>
<tr><td><dt>RS-274D</dt></tr></td>
<tr><td><dt>RS-274X</dt></tr></td>
<tr><td><dt>Rubylithe</dt></tr></td>
<tr><td><dt>Scoring</dt></tr></td>
<tr><td><dt>Short</dt></tr></td>
<tr><td><dt>Silk Screen</dt></tr></td>
<tr><td><dt>Silk</dt></tr></td>
<tr><td><dt>silk</dt></tr></td>
<tr><td><dt>single-sided</dt></tr></td>
<tr><td><dt>SIP</dt></tr></td>
<tr><td><dt>slot</dt></tr></td>
<tr><td><dt>SMD</dt></tr></td>
<tr><td><dt>SMOBC soldermask over bare copper</dt>  prevent unintended flow of tin/lead during reflow </tr></td>
<tr><td><dt>SMT</dt></tr></td>
<tr><td><dt>Snap</dt></tr></td>
<tr><td><dt>SOIC</dt></tr></td>
<tr><td><dt>Solder Side</dt></tr></td>
<tr><td><dt>Solder</dt></tr></td>
<tr><td><dt>STEP</dt></tr></td>
<tr><td><dt>Subcircuit</dt></tr></td>
<tr><td><dt>Substrate</dt></tr></td>
<tr><td><dt>Subtractive</dt></tr></td>
<tr><td><dt>Symbol</dt></tr></td>
<tr><td><dt>Tape out</dt></tr></td>
<tr><td><dt>TCE thermal coefficient of expansion</dt></tr></td>
<tr><td><dt>tEDAx</dt></tr></td>
<tr><td><dt>Tented(Via)</dt></tr></td>
<tr><td><dt>terminal</dt></tr></td>
<tr><td><dt>TG Glass transition temp</dt></tr></td>
<tr><td><dt>Thermal Via Thermal relief</dt></tr></td>
<tr><td><dt>Thou</dt></tr></td>
<tr><td><dt>Tin Whisker</dt></tr></td>
<tr><td><dt>Tin</dt></tr></td>
<tr><td><dt>TinyCAD</dt></tr></td>
<tr><td><dt>Tolerance</dt></tr></td>
<tr><td><dt>tombstone</dt></tr></td>
<tr><td><dt>tooling</dt></tr></td>
<tr><td><dt>toolpath generator</dt></tr></td>
<tr><td><dt>toolpath</dt></tr></td>
<tr><td><dt>toporouter</dt></tr></td>
<tr><td><dt>Trace</dt></tr></td>
<tr><td><dt>TT toner transfer</dt></tr></td>
<tr><td><dt>V-Cut</dt> aka v-scoring</tr></td>
<tr><td><dt>V-score</dt></tr></td>
<tr><td><dt>Vcc</dt></tr></td>
<tr><td><dt>Vdd</dt></tr></td>
<tr><td><dt>Vector</dt></tr></td>
<tr><td><dt>Via stitching</dt></tr></td>
<tr><td><dt>Via</dt></tr></td>
<tr><td><dt>Wave Solder</dt></tr></td>
<tr><td><dt>Wire bonding</dt></tr></td>
<tr><td><dt>XY</dt></tr></td>
</table>